
Diamond Discs Green Sic Micro Powder Shaping Grain Refractory Abrasive Silicon Carbide Abrasive Powder for Polishing/Grinding
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- Overview
- Product Description
- Specification
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Basic Info.
| Common Name | Green Silicon Carbide Micropowder, Green Sic Fine |
| Chemical Formula | Sic |
| Lead Time | 7-15 Days for Standard Sizes |
| MOQ (Minimum Order Quantity) | 1 Ton, or Negotiable |
| Transport Package | 25kg/PP Bag, Then 40 Bags in One Ton Bag |
| Specification | Customized |
| Origin | China |
| HS Code | 2849200000 |
| Production Capacity | 10000tons/Month |
Product Description
Product DescriptionGreen Silicon Carbide for PolishingHenan Yumo New Materials' polishing-specific green silicon carbide micro powder is an ultrafine abrasive meticulously crafted to meet the demands of high-end precision surface treatment. Its particle size ranges from F400 (17 μm) to F2000 (3 μm) and even finer submicron levels. With its extremely high purity, sharp micro-edges, precise particle size control, and excellent chemical stability, it is an ideal choice for achieving ultra-smooth, damage-free surfaces, and is widely used in the final polishing processes of optical, semiconductor, precision ceramic, and high-end metal workpieces.Specification
| Key Characteristics & Advantages | ||
| Characteristic Dimension | Detailed Description | Value Created for Customers |
| Exceptional Hardness & Nano-scale Cutting Ability | Mohs hardness of 9.2–9.3 combined with sub-micron sharp edges enables atomic-level material removal. | Achieves ultra-low surface roughness (Ra < 0.01 μm) with mirror-like finish, meeting the highest optical and surface finish requirements. |
| Excellent Chemical Stability | Resistant to acids and alkalis; does not react with common polishing fluid media. | Contamination-free polishing process without introducing chemical impurities, preserving the intrinsic properties of the workpiece—ideal for semiconductor and optical applications. |
| Precise Particle Size Distribution | Utilizes multi-stage hydraulic classification with extremely narrow distribution (Span < 0.8) and no oversized particles. | Provides uniform, scratch-free polishing with predictable and repeatable material removal rates, improving product yield. |
| High Purity & Low Impurities | SiC ≥ 99%, Fe2O3 ≤ 0.08%, and extremely low metal impurity content. | Eliminates surface contamination, preventing ionic contamination or discoloration when polishing silicon wafers, sapphire, and precision alloys. |
| Good Dispersion Stability | Uniform particle morphology; dispersion in oil-based/water-based systems can be further optimized via surface treatment (e.g., silanization). | Ensures stable polishing slurry with slow settling, facilitating automated production and guaranteeing process stability. |
| Typical Applications & Grit Selection | |||
| Application Areas | Typical Workpiece Materials | Recommended Grit Size (FEPA) | Value and Polishing Objectives |
| Precision Optical Components | Optical glass, crystal, microcrystalline glass, sapphire cover plates | F800 – F1500 | Achieve nanoscale surface finish (Ra 0.2–0.5 µm) and high surface figure accuracy, minimize light scattering, ensure imaging quality. |
| Semiconductor Substrates | Silicon wafer, silicon carbide (SiC) ,arsenide (GaAs) substrate | F1000 – F2000 | Used for backside thinning and CMP processes, achieve global planarization with no surface damage layer, improve device electrical performance and reliability. |
| High-end Metal Components | Stainless steel mirror rods, aluminum alloy hard disk substrates, precision mold steel | F600 – F1200 | Obtain metallic mirror finish without orange peel or micro-scratches, improve surface corrosion resistance, wear resistance, and aesthetics. |
| Industrial Ceramics and Gemstones | Zirconia ceramic parts, silicon nitride bearing balls, synthetic gemstones | F400 – F1000 | Efficiently remove fine grinding marks, achieve high-gloss effect with no edge chipping, maintain material integrity. |
| Luxury Goods Surface Treatment | Watch cases, jewelry, high-end pen accessories | F800 – F1500 | Achieve deep, uniform mirror effect, enhance product grade and added value. |
| Product Specifications | ||
| Parameter Category | Henan Yumo (YUMO) Polishing Grade Standard | Test Method/Remarks |
| Chemical Composition | • SiC: ≥ 99% • Fe2O3: ≤ 0.08% (Core Indicator) • Free C: ≤ 0.20% • SiO2: ≤ 0.15% | Chemical Analysis / XRF Spectrometry |
| Particle Size Distribution | F400, F500, F600, F800, F1000, F1200, F1500, F2000. D50 control precision, D100 no oversized particles. | Laser Particle Size Analyzer (per ISO 8486-2 standard) |
| Magnetic Content | ≤ 30 ppm | High-precision magnetic separation measurement |
| Surface Treatment | Standard version is hydrophilic. Customized solutions such as silane treatment available to optimize dispersibility and stability in different polishing media. | - |
| Packaging | 5kg/10kg/25kg vacuum aluminum foil bags or plastic bottles, filled with inert gas. | Prevents moisture absorption and oxidation, ensures product activity. |
Allofourabrasiveproductsarecarefullyprocessed duringstorageandtransportationtomaintaintheir qualityintheiroriginalstate.FAQHigh-impact FAQQ: How do you prevent batch variations that disrupt production?
Yumo's Edge: Al real-time laser QC +100% SEM shape scan Result: 99.98% identical grains (vs. industry 95-98%)
Proof: Zero client line stoppages since 2022 Q: Can you handle urgent orders during raw material shortages?
Yumo's Edge: Owned mines +30,000-ton strategic reserve
Result: 98.6% on-time rate (industry avg: 82%)
Proof: Shipped 500-ton to Germany during Suez blockage Q: Do you just ship products, or optimize our process?
Yumo's Edge: Free application labs +PhD engineers on call
Result: 32% avg. cost reduction (e.g., Schaeffler cut coolant use 40%)
Proof: Client ROI report within 30 days Q: Why pay slightly more upfront?
Yumo's Edge: 2.3x longer life→30% less changeover downtime 18% energy savings →$0.80/kg true cost reduction
Proof: Toyota Boshoku saved $220K/year switching to Yumo
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